MAGIC (214945)

  https://cordis.europa.eu/project/id/214945

  FP7 (2007-2013)

  MAsk less lithoGraphy for IC manufacturing (MAGIC)

  Next-generation nanoelectronic components and electronics integration (ICT-2007.3.1)

  software  ·  semiconductivity

  2008-01-01 Start Date (YY-MM-DD)

  2010-12-31 End Date (YY-MM-DD)

  € 16,694,010 Total Cost

  Description

In the CMOS manufacturing environment, the mask-based optical lithography technique is up to now the driving solution to deal with all industry concerns. Nevertheless, this solution becomes less effective for each new technology node. Effectively, it requires more and more complex and expensive masks due to the introduction of optical proximity correction and phase shift techniques. The blow up of the tool price plays also an important role in the overall cost of ownership of this technique. This trend opens opportunities for the Mask-Less Lithography (ML2) technology, based on multi-beam principles and developed by the two European companies MAPPER and IMS Nanofabrication AG. The cost effective model of the ML2 option in association with the high resolution capability of the electron lithography and a reasonable throughput target represents an attractive alternative for lithography and is supported by some key CMOS manufacturers around the world, like TSMC, STMicroelectronics, QIMONDA, TOSHIBA, and Texas Instruments...<br/>This project proposes to support the development of ML2 technology in Europe. It is composed of two linked poles. The first one will be focused on MAPPER and IMS-NANO tool developments with the objective to deliver a first ML2 alpha platform compatible for 32nm half pitch technology before 2010, aligned with the semiconductor manufacturer requirements. In relation with this activity, the program will develop the required infrastructure for the usage of these tools in an industrial environment. Among the tasks to be addressed, there is the delivery of a reliable software platform to treat the data base preparation and to provide solution for ML2 related electron beam proximity effects. The last concern of this project will be to demonstrate the ability to integrate CMOS processes in real manufacturing conditions on the ML2 platforms developed by the tool partners.

  Complicit Organisations

1 Israeli organisation participates in MAGIC.