LEAP TOMOGRAPHY (221143)
https://cordis.europa.eu/project/id/221143
FP7 (2007-2013)
Exploring the three-dimensional nanoscale space around defects in Ni-based superalloys for aircraft applications employing atom-probe tomography
Marie Curie Action: "International Outgoing Fellowships for Career Development" (PEOPLE-2007-4-1.IOF)
aircraft · electron microscopy
2008-03-01 Start Date (YY-MM-DD)
2011-07-01 End Date (YY-MM-DD)
€ 242,235 Total Cost
Description
The research proposed is part of an extensive work aimed at investigating the formation of defects during the solidification of Nickel-based superalloys, where the goal is establishing criteria that enable avoiding their formation. We intend to employ the latest version of the Atom-Probe Tomograph, namely the Local-Electrode Atom-Probe (LEAP), which is the best analytical experimental tool available today for characterizing the chemistry of solid materials in the sub-nanometric scale. The results obtained by LEAP will be used as input data for ab-initio Molecular Dynamics (AIMD) simulations and compared with nano-mechanical testings. The approach of combining both LEAP tomography results with mechanical behavior in the nano-scale, as well as implementing AIMD, may serve as a very powerful tool in the understanding of materials science fundamentals, e.g. the correlation between mechanical properties, composition, and morphology. Specialization in the most powerful atomistic-tomography tool known today, the LEAP, is essential for preserving the high level of scientific research in Israel, thus encouraging further scientific collaboration between Israel and other EU countries as well as the USA. We intend to perform the LEAP characterization work as well as the analytical modeling at the Northwestern University Center for Atom-probe Tomography (NUCAPT) leaded by Prof. David Seidman. The rest of the research work including Transmission Electron Microscopy (TEM) as well as computer-aided simulations will be performed in the return stage at the Technion, Faculty of Materials Engineering, and leaded by Prof. Wayne Kaplan.